HDI
FS & FST RoHS-Compliant High-Density Interconnect PCB
1. Product Overview
The FS & FST Series Multilayer PCB is a high-density interconnect (HDI) printed circuit board designed for high-performance industrial control, communication infrastructure, server, and precision electronic equipment. It adopts advanced multilayer lamination and precision machining technology, featuring high integration, stable electrical performance, and excellent mechanical reliability, meeting the demanding requirements of high-speed signal transmission and long-term stable operation in complex working environments.
2. Core Technical Specifications
| Parameter | Specification |
|---|---|
| Board Layers | 8-32 layers (customizable) |
| Base Material | FR-4 (Tg 150℃/170℃), High-Tg FR-4, Rogers (optional for high-frequency applications) |
| Board Thickness | 1.0mm - 6.0mm (±0.1mm tolerance) |
| Copper Thickness | 1oz (35μm), 2oz (70μm), 3oz (105μm) (inner/outer layer customizable) |
| Minimum Trace Width | 3mil (0.075mm) |
| Minimum Trace Spacing | 3mil (0.075mm) |
| Minimum Drill Diameter | 0.15mm (mechanical drill), 0.1mm (laser drill for HDI) |
| Aspect Ratio | ≤12:1 |
| Board Size | Max. 450mm × 350mm (customizable per customer drawing) |
3. Process & Surface Treatment
- Lamination Process: Multilayer vacuum lamination, sequential lamination (for HDI blind/buried vias)
- Via Type: Through-hole vias, blind vias, buried vias (HDI structure optional)
- Surface Finish: ENIG (Electroless Nickel Immersion Gold, 2-5μ" Ni + 0.05-0.1μ" Au), HASL (Lead-free), Immersion Silver, Immersion Tin (optional)
- Solder Mask: Green/black/blue/red solder mask (epoxy liquid photoimageable solder mask)
- Silkscreen: White/black ink, minimum character height 0.8mm
4. Electrical Performance
- Dielectric Strength: ≥50kV/mm (standard condition)
- Insulation Resistance: ≥1×10¹²Ω (500V DC, standard condition)
- Thermal Conductivity: ≥0.8W/m·K (standard FR-4), ≥2.0W/m·K (high thermal conductivity material optional)
- Impedance Control: ±10% (50Ω/75Ω/90Ω/100Ω customizable for high-speed signals)
- Voltage Withstand: No breakdown at 1000V AC/1min (standard condition)
5. Mechanical & Environmental Performance
- Peel Strength: ≥1.0N/mm (copper foil to substrate)
- Bending Strength: ≥350MPa
- Operating Temperature: -40℃ ~ +125℃ (High-Tg version: -40℃ ~ +150℃)
- Thermal Cycling: Pass 1000 cycles (-40℃ ~ +125℃, 30min per cycle) without delamination or crack
- Moisture Resistance: Pass IPC-TM-650 2.6.3 test (no blistering, delamination)
- Flammability: UL94 V-0
6. Reliability & Compliance
- Comply with IPC-A-600 (Class 2/Class 3)
- Comply with RoHS 2.0 (2011/65/EU) and REACH regulations
- Pass thermal shock, humidity resistance, and solderability tests per IPC-TM-650
- 100% electrical test (flying probe test/bed of nails test optional)
7. Application Fields
- Industrial control systems & PLC
- Communication base stations & optical communication equipment
- Server & data center hardware
- Automotive electronics (non-safety critical parts)
- Medical diagnostic equipment
- Aerospace & military electronic modules (customized version)
8. Packaging & Storage
- Packaging: Vacuum packaging with anti-static bag + carton box (with moisture-proof desiccant)
- Storage: Store in dry environment (temperature: 15-30℃, humidity: 30-70%RH), avoid direct sunlight and heavy pressure
- Shelf Life: 12 months (under proper storage conditions)
新闻
联系我们
深圳方晟醇和科技有限公司
手机: 86 13428289130
电话: 86 13428289130
邮箱: overseas@fangshengtech.com
地址: 深市宝安区石岩街道塘头社区松白公路西侧宗泰电商科创园B308
