PCB Welding：

• PCB processing technology up to 64 layers, with minimum trace width/spacing of 2.5/2.5 mil and maximum aspect ratio (board thickness to hole diameter) of 16:1.

• Long & short gold finger processing and high-density circuit precision control, meeting the PCB design requirements of the optoelectronic communication field.
• High-precision back-drilling technology to reduce the equivalent series inductance of vias, ensuring product signal transmission integrity.
• Excellent metal-based and ultra-thick copper manufacturing processes, satisfying the high heat dissipation requirements of power supply products.
• High-precision mechanical and laser depth-control processes to realize multi-step groove structures, meeting the multi-level assembly requirements of products.
• Mature hybrid lamination technology for FR-4 and high-frequency materials, saving material costs for customers while ensuring high-frequency performance.
• Advanced Anti-CAF process, greatly improving the reliability and service life of PCB products.
• Leading embedded capacitor and embedded resistor technologies, significantly enhancing the overall performance of PCBs.

Strict Quality Management for PCBs

4.GJB 9001B Military Standard System Certification;

5.Compliance with enterprise standards of Huawei, ZTE, etc.;

6.Customized PCB processing strictly managed in accordance with IPC‑A‑600 Class 1/2/3, military standards, customer specifications and internal enterprise standards;

7.Strict customer information confidentiality management system.

Advanced Processing and Testing Equipment

9.A full range of reliability testing equipment, including ion contamination testers, peel strength testers, copper thickness testers, 2D measuring machines, gold thickness testers, etc., to strongly ensure the quality of customers’ PCB products.