High-Performance RF/Communication Module PCB with Integrated Circuitry

1. Product Overview

2. Core Product Parameters

3. Material & Construction

• Base Material: Adopts high-temperature resistant, low-loss high-frequency substrate or high-Tg FR-4 material, ensuring stable electrical performance under high-frequency and high-temperature conditions.
• Layer Structure: Multi-layer stack-up design with precise dielectric layer control, supporting impedance matching for high-frequency signals (50Ω / 75Ω impedance customizable).
• Solder Mask: Green solder mask (other colors: black, blue, red customizable) with high insulation and solder resistance.
• Silkscreen: White silkscreen for component marking, meeting IPC standard for legibility.

4. Electrical & Environmental Performance

• Working Voltage: ≤ 500V (AC)
• Insulation Resistance: ≥ 1×10¹² Ω (standard condition)
• Dielectric Withstanding Voltage: ≥ 3kV (AC, no breakdown)
• Working Temperature: -40℃ to +125℃ (industrial grade)
• Thermal Cycle Resistance: Passes 1000 cycles of -40℃ ~ +125℃ thermal shock, no delamination or crack
• Humidity Resistance: Passes 85℃ / 85%RH humidity test for 1000 hours, stable electrical performance

5. Manufacturing & Process Features

• High-Density Integration: 4-in-1 panel design optimizes production efficiency and reduces assembly cost, suitable for mass production.
• Precision Machining: Advanced laser drilling and electroplating technology ensures via hole reliability and circuit accuracy.
• Impedance Control: Precise impedance matching for high-frequency transmission lines, with impedance tolerance ±10%.
• Lead-Free Process: Compliant with RoHS, REACH environmental protection standards, halogen-free material optional.

6. Application Scenarios

• RF communication modules (5G/4G small base stations, wireless routers)
• High-frequency signal transmission equipment
• IoT smart terminal control boards
• Automotive electronic communication modules
• Industrial control RF sensing boards

7. Quality & Compliance Standards

• IPC-A-600 Class 2 / Class 3 (customizable)
• IPC-6012 for rigid PCB requirements
• RoHS 2.0, REACH environmental certification
• ISO 9001 quality management system certification

8. Packaging & Storage

• Packaging: Anti-static vacuum packaging, with moisture-proof and shock-proof protection.
• Storage: Store in a dry environment (temperature: 15℃ - 35℃, humidity: 30% - 70% RH), avoid direct sunlight and corrosive gases; shelf life: 12 months (unopened packaging).