FS & FST Series Precision Multilayer PCB with Impedance Control & High Reliability

1. Product Introduction

2. Core Technical Parameters

3. Impedance Control Performance

• Controlled Impedance Types: Single-ended impedance (50Ω/75Ω), differential impedance (90Ω/100Ω/120Ω)
• Impedance Tolerance: ±8% (Class 3 high-precision standard)
• Impedance Testing: 100% impedance testing via TDR (Time Domain Reflectometer)
• Dielectric Constant Stability: Dk tolerance ±0.05, ensuring consistent impedance performance across the board

4. Manufacturing Process & Surface Treatment

4.1 Lamination & Via Technology

• Lamination process: Vacuum multi-layer lamination, sequential lamination (for HDI blind/buried vias)
• Via types: Through-hole vias, blind vias, buried vias, via-in-pad (VIP) for high-density design
• Plating: Electroless copper + electrolytic copper plating, hole wall copper thickness ≥20μm

4.2 Surface Finish Options

• ENIG (Electroless Nickel Immersion Gold): Ni 3-5μm, Au 0.05-0.1μm (recommended for high reliability)
• Immersion Silver: 0.1-0.3μm (excellent solderability)
• Immersion Tin: 0.8-1.2μm (cost-effective, good thermal stability)
• Lead-free HASL (Hot Air Solder Leveling): RoHS compliant, suitable for mass production

4.3 Solder Mask & Silkscreen

• Solder Mask: Liquid photoimageable solder mask (LPI), colors available in green, black, blue, red
• Silkscreen: White/black ink, minimum character height 0.6mm, clear marking for components and test points

5. Electrical Performance

• Dielectric Strength: ≥50kV/mm (under standard atmospheric conditions)
• Insulation Resistance: ≥1×10¹²Ω (tested at 500V DC)
• Voltage Withstand: No breakdown or flashover at 1500V AC for 60 seconds
• Thermal Conductivity: ≥0.8W/m·K (standard FR-4), ≥2.0W/m·K (high thermal conductivity material)
• Signal Loss: ≤-0.5dB/inch at 10GHz (high-frequency material version)

6. Mechanical & Environmental Reliability

6.1 Mechanical Properties

• Peel Strength: ≥1.2N/mm (copper foil to substrate, IPC-TM-650 2.4.8)
• Bending Strength: ≥400MPa, no cracking under 180° bending test
• Solderability: 100% wettable, no cold solder or non-wetting after 3 times reflow at 260℃

6.2 Environmental Adaptability

• Operating Temperature: -55℃ ~ +150℃ (High-Tg version: -55℃ ~ +175℃)
• Thermal Cycling: Pass 1200 cycles (-40℃ ~ +125℃, 30min/cycle) without delamination, cracking or impedance drift
• Moisture Sensitivity: MSL Level 3, no blistering after 85℃/85%RH/168h humidity test
• Flammability: UL94 V-0, halogen-free version available

7. Quality & Compliance Standards

• Comply with IPC-A-600 Class 2/Class 3 (high-reliability version meets Class 3)
• Comply with IPC-6012 (Qualification and Performance Specification for Rigid Printed Boards)
• RoHS 2.0 (2011/65/EU) and REACH compliant, lead-free and halogen-free options available
• 100% electrical test (flying probe test for high-precision boards, bed of nails test for mass production)
• Pass IPC-TM-650 standard tests for thermal shock, solder resistance, and chemical resistance

8. Application Fields

• High-speed communication equipment (5G base stations, optical transceivers, routers)
• Industrial control systems, PLC, servo drives
• Servers, data center hardware, high-performance computing (HPC)
• Automotive electronics (ADAS, infotainment systems)
• Medical diagnostic equipment, precision instruments
• Aerospace and military electronic modules (customized high-reliability version)

9. Packaging & Storage

• Packaging: Anti-static vacuum packaging + moisture-proof carton, with desiccant and humidity indicator card
• Storage Conditions: Temperature 10-30℃, relative humidity 30-70%RH, avoid direct sunlight, heavy pressure and corrosive gases
• Shelf Life: 12 months (unopened vacuum packaging); 6 months after opening (stored in dry cabinet)